Winner / 2026

3D Aluminum-Microchannel Thermosyphon Heat Sink

By: Industrial Technology Research Institute (ITRI)
Silver

Category: Commercial Technology

Sub-Category: Data Center Solutions

The 3D Aluminum-Microchannel Thermosyphon Heat Sink is a next-gen air-cooling system. It uses capillary-free microchannels and balanced pressure control to replace liquid cooling, efficiently supporting heat loads above 1.5 kW. Tailored for HPC servers, it offers superior cooling with a lightweight, durable, and cost-effective thermal solution.

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