Winners / 2025

Celanese CoolPoly(TM) D5522 LCP

By: CELANESE
Silver

Master Category:

Award Category: AI Driven Advancements

Award Sub-Category: Semiconductor Innovations for AI & HPC

CoolPoly® D5522 enabled breakthrough application specific electronic package (ASEP) technology due to its laser-induced electrically conductive surface, thermal conductivity, high heat resistance, and high flowability. ASEP makes it possible to develop smaller and higher performance switch/sensor with lower cost.

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