Winners / 2023

DOWSIL™ TC-3035 S Thermal Gel

By: Dow Performance Silicones
Silver

Master Category:

Award Category: Materials Science

Award Sub-Category: Next Generation Manufacturing

DOWSIL™ TC-3035 S thermal gel allow high density chipset architecture designs to power the ultra-slim 5G smartphone with high thermal conductivity and ultra-soft conformability. The excellent dispensability and unique cure feature significantly improve the manufacturing efficiency and enable chipset recycling to address the Si chip supply shortage.

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