Winners / 2026

3D Aluminum-Microchannel Thermosyphon Heat Sink

By: Industrial Technology Research Institute (ITRI)
Silver

Master Category:

Award Category: Commercial Technology

Award Sub-Category: Data Center Solutions

The 3D Aluminum-Microchannel Thermosyphon Heat Sink is a next-gen air-cooling system. It uses capillary-free microchannels and balanced pressure control to replace liquid cooling, efficiently supporting heat loads above 1.5 kW. Tailored for HPC servers, it offers superior cooling with a lightweight, durable, and cost-effective thermal solution.

Explore more Commercial Technology

Put your innovation in the spotlight.

For four decades, the Edison Awards have recognized innovative products, services, and technologies that create meaningful value and impact. Explore the categories, find the right fit, and enter your new innovation for recognition.

Ready for Nomination Season?

Complete the form below to download the 2027 Nomination Guide.

A Founders Guide to Modern Innovation
The Future of the Grid – Panel Discussion 2024 Edison Awards
Edison Award-Winning Brain Technology Featured in U.S. News & World Report